Low-Silver Type TK PASTE CR-2800

A Solution to Rising Silver Prices.
Low-Silver Conductive Adhesive Using Specially Shaped TK Silver Powder "TK Paste CR-2800"

TK Paste CR-2800 is a low-silver-content conductive adhesive that uses KAKEN TECH's proprietary specially shaped TK Silver Powder.
It significantly reduces silver usage compared with conventional silver pastes while maintaining electrical conductivity. As a low-silver conductive adhesive for grounding and EMI shielding applications, it helps reduce silver paste costs.

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Features	Solutions	TK Silver Powder	Product Information
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Product Features

Low-Silver, Low-Cost Design with Specially Shaped TK Silver Powder

TK Paste CR-2800 is a low-silver-content conductive adhesive that uses KAKEN TECH's proprietary specially shaped "TK Silver Powder."
Conventional conductive adhesives and silver pastes require a large amount of silver to achieve high conductivity. In contrast, the three-dimensional burr-like structure of TK Silver Powder improves contact efficiency between silver particles, enabling conductivity with a low silver content of just 50 wt%.
It is ideal for customers seeking to reduce costs while maintaining sufficient conductivity for applications such as grounding and shielding.

Reduced Consumption and Lower Total Cost Through Low Specific Gravity

By reducing silver content, CR-2800 achieves a low specific gravity of 2.1. Compared with conventional high-silver pastes, a greater application volume can be obtained from the same weight of material, helping reduce the amount of material that needs to be purchased.
For applications that tend to consume large quantities, such as grounding large enclosures or applying material to EMI shielding components, cost benefits can be expected not only from the product price but also from reduced actual material consumption.

Conductivity and Reliability Suitable for Grounding and Shielding Applications

CR-2800 is a conductive adhesive developed for grounding and EMI shielding applications.
It is suitable for applications where stable electrical continuity and cost balance are more important than high current capacity, such as enclosure grounding, ensuring conductivity in shielding cases, and connecting electromagnetic interference countermeasure components.
In addition, because it is a heat-curing type, it provides excellent stability after bonding and can be used in a wide range of fields, including electronic equipment, telecommunications equipment, and automotive electronic components. It achieves both reduced cost and reliable conductive connections.

Common Challenges with Conductive Connections in Electronic Components

Increasing Material Costs Due to Rising Silver Prices
Recent increases in silver prices have significantly raised procurement costs for conductive adhesives.
Reducing the Cost of EMI Countermeasure Components
Electrical conductivity is sufficient for grounding and shielding connections, but material costs are too high.
High Material Consumption Due to Large Application Volumes
Consumption of conductive paste is increasing for grounding large enclosures and long components.

Specially Shaped TK Silver Powder: The Technology Behind TK Paste

TK Paste uses KAKEN TECH's proprietary specially shaped silver powder, "TK Silver Powder." Unlike conventional spherical silver powder, its three-dimensional burr-like structure improves contact efficiency between silver particles, delivering high electrical conductivity while reducing silver content.

Comparison with Conventional Silver Paste

Item	CR-2800	Conventional High-Silver Paste
Silver Content	50 wt%	Approx. 80 wt%
Feature	Low Cost	High Conductivity
Applications	Grounding / Shielding	Component Assembly / Die Bonding

What Is a Low-Silver Conductive Adhesive?

Why is silver used in conductive adhesives? Why are silver pastes expensive? And why is reducing silver content becoming increasingly important? The following page provides a detailed explanation of KAKEN TECH's low-silver, high-conductivity technology using proprietary specially shaped TK Silver Powder.

What Are Conductive Adhesives Made with TK Silver Powder?

KAKEN TECH's proprietary TK Silver Powder technology helps reduce material costs by maintaining conductivity while reducing silver content. For details on how conductive adhesives work and the benefits of reducing silver content, see this explanatory page.

Low-Silver Conductive Adhesive CR-2800

	TK Paste CR-2800 uses burr-like TK Silver Powder and is an exceptionally low-silver paste that achieves volume resistivity in the 10^-3 Ω・cm range with a silver content of only 50 wt%. Its specific gravity is also low at 2.1. Compared with conventional products containing 80 wt% silver, the usable volume per unit weight is approximately doubled, reducing paste usage cost by half. ☆ Complies with China's VOC regulation (GB33372-2020) ☆

Properties

Application	Binder	Volume Resistivity	Thermal Conductivity	Viscosity	Curing Temperature / Time	Packaging	Storage
Grounding Shielding	Epoxy Resin	6×10^-3Ω・cm	-	30Pa・S	90℃×60 min	10g Syringe	Frozen (-10℃ or below)

Main Applications

EMI Shielding Gaskets
Grounding Connections for Metal Enclosures
Shielding Case Fixing
Electromagnetic Interference Countermeasure Components
Telecommunications Equipment
Automotive Electronic Equipment

Frequently Asked Questions

Does the low-silver type provide sufficient conductivity?

CR-2800 uses specially shaped TK Silver Powder to provide electrical conductivity while reducing silver content. It is suitable for grounding and shielding connection applications.

How much silver does it contain?

CR-2800 is a low-silver type with a silver content of 50 wt%.

What applications is it suitable for?

Grounding connections
EMI shielding
Ensuring electrical continuity
Electromagnetic interference countermeasure components, etc.

Does TK Paste need to be stored frozen?

To maintain product quality, we recommend storing TK Paste frozen at -10℃ or below. Before use, allow the product to thaw naturally to room temperature. Please refer to the technical documentation and instruction manual for each product for details.

What is the difference between low-silver and high-silver types?

Low-silver types are suitable when cost is the priority, while high-silver types are suitable when high electrical conductivity or thermal conductivity is the priority.

Other TK Paste Products

Room-Temp. Drying Type

Low-Temp. Curing Type

High Reliability Type

Low-Temp. Sintering Type

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The information provided on this page is for reference purposes and is based on evaluation data and technical knowledge obtained by KAKEN TECH. Actual applicability and performance may vary depending on the conditions of use, adherend materials, design conditions, operating environment, and other factors. Before adopting the product, please conduct sufficient evaluation and verification under your actual operating conditions and make your own determination. KAKEN TECH does not guarantee performance or suitability for the applications or examples described on this page.

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What Is a Low-Silver Conductive Adhesive? Low-Silver Type TK PASTE CR-2800