For Conductive Connections of Heat-Sensitive Electronic Components.
Conductive Adhesive That Cures at 100℃×60min
"TK PASTE CR-5200"
TK Paste CR-5200 is a low-temperature-curing conductive adhesive developed for resin components, film devices, and various sensors.
It enables conductive connections by curing at a low temperature of 100℃×60 minutes, reducing thermal damage compared with soldering. KAKEN TECH's specially shaped TK Silver Powder provides both excellent conductivity and connection reliability.
Product Features
01
Reduced Thermal Damage with Low-Temperature Curing at 100℃×60 Minutes
This low-temperature-curing conductive adhesive was developed for electronic materials that are sensitive to high-temperature processes, including film substrates, resin components, and various sensors.
Because it cures at 100℃×60 minutes, thermal stress can be significantly reduced compared with conventional soldering and high-temperature-curing conductive adhesives. It is suitable for conductive connections involving low-heat-resistance materials, which are increasingly used as electronic devices become smaller and lighter.
02
Low Contact Resistance Design with Specially Shaped TK Silver Powder
For conductive adhesives, not only the resistance of the material itself but also the contact resistance generated at the bonding interface is important.
CR-5200 uses KAKEN TECH's proprietary specially shaped TK Silver Powder to increase the contact area with the bonded material. It provides stable electrical conductivity with SUS and various other metal materials. Its low contact resistance enables stable connections for electronic component assembly and grounding applications.
Contact Resistance with SUS316L
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＜Reduced Contact Resistance with Specially Shaped TK Silver Powder＞
03
Stable Conductivity Even in High-Temperature, High-Humidity Environments
Depending on the operating environment and connected materials, the silver contained in conductive adhesives may cause metal corrosion (galvanic corrosion) under high-temperature, high-humidity conditions, potentially reducing conductivity and connection strength. TK PASTE CR-5200 uses specially shaped TK Silver Powder to suppress the progression of corrosion and maintain stable conductivity even after long-term high-temperature, high-humidity testing. It is suitable for applications where reliability is important, including electronic components and sensors.
Corrosion Caused by Contact Between Dissimilar Metals (Galvanic Corrosion) |
High-Temperature, High-Humidity Test Results
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To compare changes in resistance between CR-5200 and conventional conductive adhesives during a high-temperature, high-humidity test, Sn wires were fixed to gold (Au) terminals using conductive adhesive.
After being placed in a high-temperature, high-humidity test chamber, resistance values were measured at each specified time interval. |
What Is Contact Resistance?
Contact resistance is the resistance that exists at the interface between an adhesive and the bonded material. The graph above shows resistance measurements obtained by bonding SUS316L plates with each conductive adhesive, as shown in the photograph on the right.
Stainless steel in particular has a passive film on its surface, which increases contact resistance.
CR-5200, however, provides good electrical conductivity. |
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Common Challenges in Conductive Connection Processes for Electronic Components
- Thermal Damage to Electronic Components from Soldering
Low-heat-resistance materials such as resins and films are being used, and deformation or performance degradation caused by reflow or soldering has become a problem. You are looking for an alternative method that enables conductive connections at lower temperatures.
- Resistance Changes Due to Insufficient Reliability of Conductive Adhesives
Connection resistance increases after temperature cycling or high-temperature, high-humidity testing, creating long-term reliability concerns. You want to maintain stable conductivity even under harsh environmental conditions.
- Higher Material Costs Due to Rising Silver Prices
You are using conductive adhesives with high silver content, and rising material costs have become an issue. You are considering materials that can reduce costs while maintaining performance.
- Choosing Between Conductive Adhesives and Soldering
As electronic components become smaller and lighter, you are considering conductive adhesives but are unsure which applications they are suitable for. You want to select the appropriate material for each application.
What Is a Low-Temperature-Curing Conductive Adhesive?
Why are conductive adhesives attracting attention for mounting film and resin components? Why can soldering be difficult for these materials? How does low-temperature-curing technology contribute to smaller and lighter electronic devices?
This page provides a detailed explanation of the fundamentals of conductive adhesives.
Comparison with Solder Paste
| Item |
CR-5200 |
Typical Soldering |
| Bonding Temperature |
100℃×60 min |
200℃ or higher |
| Film Substrates |
◎ |
△ |
| Resin Components |
◎ |
△ |
| Conductive Connection |
◎ |
◎ |
| Adhesive Function |
◎ |
× |
Low-Temperature-Curing Conductive Adhesive CR-5200
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TK Paste CR-5200 is a low-temperature, short-time-curing conductive adhesive developed for assembling low-heat-resistance modules and mounting components.
It maintains stable characteristics with minimal resistance change even after temperature cycling and high-temperature, high-humidity testing.
☆ Complies with China's VOC regulation (GB33372-2020) ☆ |
Properties
Main Applications
- Electrode Connections for Film Devices
- Conductive Connections for Flexible Printed Circuit Boards
- Various Sensor Components
- Camera Modules
- Wireless Earphones
- Wearable Devices
- Electronic Component Mounting
- Grounding Connections
- EMI Shielding Connections
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Frequently Asked Questions
What is a low-temperature-curing conductive adhesive?
A low-temperature-curing conductive adhesive is a material that cures at a relatively low heating temperature and provides bonding and conductive connection at the same time. It is used for conductive connections involving films, resin components, various sensors, and other materials where thermal damage from soldering is a concern.
Can it be used as an alternative to
soldering?
Depending on the conductive connection application, it can be used as an alternative to soldering. It is particularly suitable for conductive connections to materials that are difficult to mount at high temperatures, such as film substrates and resin components.
What are the advantages compared with
soldering?
TK Paste CR-5200 is a low-temperature-curing conductive adhesive that cures at 100℃×60 minutes. This makes it easier to apply to low-heat-resistance materials such as films and resins and helps reduce thermal damage caused by soldering. Because it provides conductive connection and bonding at the same time, it can also help simplify electronic component assembly processes.
What applications is it used for?
TK Paste CR-5200 is a conductive adhesive developed for electronic component mounting and conductive connection applications. It is used for conductive connections involving electronic components made with heat-sensitive materials, including film devices, resin components, and various sensor components. It can also be used for grounding and shielding applications.
Does it cure at room temperature?
CR-5200 is a heat-curing conductive adhesive. The recommended curing condition is 100℃×60 minutes. Because sufficient curing characteristics and conductivity cannot be obtained at room temperature, always cure it under the recommended conditions. If you require a room-temperature-drying type, please consider the TK Paste CN Series.
Can it be used on film substrates and resin components?
Yes. Because CR-5200 is a low-temperature-curing type, it was developed for use with film substrates and resin components in wearable devices, flexible devices, and other applications where the thermal load of conventional soldering or high-temperature-curing conductive adhesives is a concern. Actual applicability varies depending on the type and surface condition of the material, so prior evaluation is recommended.
Can it be applied with a dispenser?
Yes. CR-5200 is supplied in a syringe and can be dispensed using an air dispenser or similar equipment. The application amount and dispensing conditions vary depending on the equipment and needle diameter used, so please refer to the technical documentation for details.
Is frozen storage required?
To maintain product quality, we recommend storing CR-5200 frozen at -10℃ or below. Before use, allow it to thaw naturally to room temperature.
Other TK Paste Products
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Product Information
- Frequently Asked Questions About Conductive Adhesives
- How do I open a syringe? Can I use the product without a dispenser? How should it be stored? This page provides answers to frequently asked questions about KAKEN TECH's TK Paste conductive adhesive series, covering everything from usage and storage to how to obtain product performance data.
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Product Information
- Low-Temperature Thermocompression-Bonding Conductive Sheet for Transparent Conductive Films
- Anisotropic conductive films (ACFs) and conductive adhesives are sometimes used instead of soldering to form conductive connections with heat-sensitive film devices. However, each has disadvantages that can prevent film devices from achieving their full performance. To address these challenges, KAKEN TECH developed TKS-030, a conductive paste that can be bonded at low temperatures.
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Product Information
- TK Paste CR-5200 Conductive Adhesive
- Advances in mobile and wearable devices have led to increased use of lightweight, thin components made from resins and films. CR-5200 was developed for conductive bonding of components and circuits with low heat resistance. Using specially shaped TK Silver Powder, it provides low electrical resistance and excellent reliability.
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Technical Solutions
- What Are Conductive Adhesives Made with TK Silver Powder?
- Discover KAKEN TECH's unique technology for low-silver, low-specific-gravity conductive adhesives using specially shaped silver powder. What makes TK Silver Powder unique? Why can it provide conductivity with less silver? What are the advantages of reducing silver content? This article answers these questions and more.
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Technical Solutions
- What Are Conductive Adhesives?
- Conductive adhesives have attracted increasing attention in recent years. This article explains how they conduct electricity, the different types of conductive adhesives, how they differ from solder and conventional adhesives, and why conductive adhesives are needed.
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Technical Solutions
- How to Use Conductive Adhesives / Silver Paste
- Conductive adhesives and silver pastes have attracted increasing attention in recent years, but incorrect handling can prevent them from delivering their full performance. Using thermosetting and drying types as examples, this guide explains how to use conductive adhesives and highlights important points for each step: thawing, cleaning, application, and curing.
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Technical Documents
- Layer Materials, Film-Formation Processes, and Device Design for Improving the Durability, Stability, and Power Generation Efficiency of Perovskite Solar Cells
- As perovskite solar cells approach practical implementation, research and development are also advancing on module structures and manufacturing methods that ensure mass productivity and reliability. This article introduces a low-temperature thermocompression-bonding conductive material that we are developing for use as external electrodes in film-type perovskite solar cells.
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The information provided on this page is for reference purposes and is based on evaluation data and technical knowledge obtained by KAKEN TECH. Actual applicability and performance may vary depending on the conditions of use, adherend materials, design conditions, operating environment, and other factors. Before adopting the product, please conduct sufficient evaluation and verification under your actual operating conditions and make your own determination. KAKEN TECH does not guarantee performance or suitability for the applications or examples described on this page.
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