High Heat Dissipation and High Bond Strength.
Conductive Adhesives for High-Reliability Electronic Components
"TK PASTE CR-3520 / CR-3990"
TK Paste CR-3520 and CR-3990 are thermosetting conductive adhesives designed with an emphasis on heat dissipation, bond strength, and reliability. They provide stable conductive connections in applications requiring high durability, including power devices and heat-generating components.
Product Features
01
High Heat Dissipation Performance Ideal for Heat-Generating Components
CR-3520 is a high-heat-dissipation conductive adhesive with a high thermal conductivity of 20 W/m$00B7K. It efficiently dissipates heat generated by power devices and other heat-generating components, helping extend product life and stabilize performance.
02
Excellent Bond Strength Even in High-Temperature Environments
CR-3990 is a high-reliability type with a high bond strength of 30 MPa. It exhibits minimal loss of strength even in high-temperature environments and maintains stable conductive connections in applications exposed to vibration and thermal cycling.
03
Developed for High-Reliability Applications
These conductive adhesives were developed for applications where connection failure is unacceptable, including automotive electronics, power modules, industrial equipment, and sensors. They are ideal for electronic component mounting where long-term reliability is a priority.
Common Challenges with Conductive Connections for High-Power Electronic Components
- Performance Degradation of Electronic Components Due to Heat
Temperature increases in power semiconductors and high-power LEDs are causing reduced performance and shorter service life.
- Need Both Heat Dissipation and Conductive Connection
You need to dissipate heat while also conducting electricity, but cannot find a suitable connection material.
- Resistance Increases After Thermal Cycling Tests
The reliability of conductive connections decreases in environments with repeated heating and cooling.
- Bond Strength Cannot Be Maintained in High-Temperature Environments
Heat generated by electronic components or high ambient temperatures is causing adhesive delamination or cracking.
- Looking for High-Reliability Materials for Automotive and Industrial Equipment
You want to select a material that can maintain stable conductive connections over long periods.
- Need Stable Application to Fine Electrodes
You want uniform, highly reproducible application to increasingly miniaturized electronic components.
What Is a High-Thermal-Conductivity Conductive Adhesive?
A high-thermal-conductivity conductive adhesive is a material that electrically connects electronic components while efficiently dissipating the heat they generate. In today's power semiconductors and high-power electronic equipment, thermal performance is considered important alongside electrical conductivity, and these adhesives are used to improve product reliability.
Selection Guide for CR-3520 and CR-3990
| Item |
CR-3520 |
CR-3990 |
| Key Feature |
High Heat Dissipation |
High Strength |
| Volume Resistivity |
5×10-5Ω・cm |
2×10-3Ω・cm |
| Application Focus |
Heat Dissipation |
Bond Strength |
| Recommended Applications |
Power Devices
Heat-Generating Components
LEDs |
High-Temperature Environments
Automotive Applications
High-Durability Applications |
CR-3520 is recommended when heat management and conductive connection of heat-generating components are required simultaneously, while CR-3990 is recommended when long-term reliability and bond strength are priorities.
High-Heat-Dissipation / High-Reliability Conductive Adhesives
 |
TK Paste CR-3520 / CR-3990 are highly conductive, highly heat-resistant, one-component heat-curing silver pastes (die-bonding pastes). They provide excellent reliability, including resistance to constant temperature and humidity conditions and thermal cycling, making them ideal for die bonding. |
Properties
High-Conductivity Type CR-3520
High-Heat-Resistance Type CR-3990
Main Applications
- Conductive Bonding of Power Modules
- Mounting Power Semiconductors (IGBT, SiC, GaN)
- Heat Dissipation and Conductive Connections for High-Power LEDs
- Conductive Bonding of Heat Sinks and Electronic Components
- High-Reliability Connections for Automotive Electronics
- Conductive Bonding of Sensors and Detectors
- Mounting Electronic Components Used in High-Temperature Environments
- Conductive Bonding in Equipment Subject to Thermal Cycling
- Dispensing onto Fine Electrodes and Small Electronic Components
- High-Durability Conductive Connections for Industrial Equipment
Frequently Asked Questions
What is a high-thermal-conductivity conductive adhesive?
A high-thermal-conductivity conductive adhesive is an adhesive that electrically connects electronic components while efficiently dissipating the heat they generate. It is used for thermal management in power devices, LEDs, and other components that generate significant heat.
What is the difference between CR-3520 and CR-3990?
CR-3520 is a high-heat-dissipation type, while CR-3990 is a high-bond-strength type. CR-3520 is recommended when thermal performance is the priority, while CR-3990 is recommended when strong bonding and durability in high-temperature environments are more important.
Yes. CR-3520 has high thermal conductivity and efficiently dissipates heat generated by electronic components and power devices. Because it provides both thermal dissipation and conductive connection, it can also help simplify assembly processes.
Can they be used with power semiconductors?
Yes. They can be used in applications such as power modules and power semiconductors where thermal performance and long-term reliability are required. Prior evaluation based on the adherend materials and operating conditions is recommended to determine actual suitability.
Can they also be used for LED mounting?
Yes. Thermal management is important for high-power LEDs, and CR-3520 is suitable for LED mounting applications because it provides conductive connection and heat dissipation at the same time.
Can they be used in high-temperature environments?
CR-3990 offers high bond strength and is designed to minimize strength loss even in high-temperature environments. It is suitable for applications requiring high durability, including automotive and industrial equipment.
Can they be used in equipment subject to thermal cycling?
Yes. CR-3520 and CR-3990 are conductive adhesives developed for applications requiring high reliability. They are designed to maintain stable conductive connections in environments where electronic components repeatedly expand and contract due to temperature changes.
Can they be applied with a jet dispenser or conventional dispenser?
Yes. CR-3520 and CR-3990 are suitable for dispenser application. They can also be applied to fine electrodes and small electronic components and can be used in mass-production processes.
How should they be stored?
To maintain product quality, store them frozen at -10℃ or below. Before use, allow them to thaw to room temperature and confirm that they have fully returned to room temperature before application.
What is the difference between a thermal interface sheet and a conductive adhesive?
A thermal interface sheet is primarily used to dissipate heat, while a conductive adhesive can provide both thermal conduction and electrical connection. When both heat dissipation and electrical connection are required, a high-thermal-conductivity conductive adhesive can be an effective solution.
Other TK Paste Products
Related Articles
 |
Product Information
- Frequently Asked Questions About Conductive Adhesives
- How do I open a syringe? Can I use the product without a dispenser? How should it be stored? This page provides answers to frequently asked questions about KAKEN TECH's TK Paste conductive adhesive series, covering everything from usage and storage to how to obtain product performance data.
|
 |
Product Information
- Low-Temperature Thermocompression-Bonding Conductive Sheet for Transparent Conductive Films
- Anisotropic conductive films (ACFs) and conductive adhesives are sometimes used instead of soldering to form conductive connections with heat-sensitive film devices. However, each has disadvantages that can prevent film devices from achieving their full performance. To address these challenges, KAKEN TECH developed TKS-030, a conductive paste that can be bonded at low temperatures.
|
 |
Product Information
- TK Paste CR-5200 Conductive Adhesive
- Advances in mobile and wearable devices have led to increased use of lightweight, thin components made from resins and films. CR-5200 was developed for conductive bonding of components and circuits with low heat resistance. Using specially shaped TK Silver Powder, it provides low electrical resistance and excellent reliability.
|
 |
Technical Solutions
- What Are Conductive Adhesives Made with TK Silver Powder?
- Discover KAKEN TECH's unique technology for low-silver, low-specific-gravity conductive adhesives using specially shaped silver powder. What makes TK Silver Powder unique? Why can it provide conductivity with less silver? What are the advantages of reducing silver content? This article answers these questions and more.
|
 |
Technical Solutions
- What Are Conductive Adhesives?
- Conductive adhesives have attracted increasing attention in recent years. This article explains how they conduct electricity, the different types of conductive adhesives, how they differ from solder and conventional adhesives, and why conductive adhesives are needed.
|
 |
Technical Solutions
- How to Use Conductive Adhesives / Silver Paste
- Conductive adhesives and silver pastes have attracted increasing attention in recent years, but incorrect handling can prevent them from delivering their full performance. Using thermosetting and drying types as examples, this guide explains how to use conductive adhesives and highlights important points for each step: thawing, cleaning, application, and curing.
|
 |
Technical Documents
- Layer Materials, Film-Formation Processes, and Device Design for Improving the Durability, Stability, and Power Generation Efficiency of Perovskite Solar Cells
- As perovskite solar cells approach practical implementation, research and development are also advancing on module structures and manufacturing methods that ensure mass productivity and reliability. This article introduces a low-temperature thermocompression-bonding conductive material that we are developing for use as external electrodes in film-type perovskite solar cells.
|
The information provided on this page is for reference purposes and is based on evaluation data and technical knowledge obtained by KAKEN TECH. Actual applicability and performance may vary depending on the conditions of use, adherend materials, design conditions, operating environment, and other factors. Before adopting the product, please conduct sufficient evaluation and verification under your actual operating conditions and make your own determination. KAKEN TECH does not guarantee performance or suitability for the applications or examples described on this page.
KAKEN TECH, MICROCLEANER, MICROCLEAN&MARKLESS and MARKLESS are trademarks of KAKEN TECH CO., LTD. in PRC.
KAKEN TECH is a trademark of KAKEN TECH CO., LTD. in the U.S..
Inquiry form