Soldering electronic components and devices to a printed wiring board is called board mounting (also called PCB mounting, electronics mounting, component mounting, etc.).
In this section, in addition to an overall explanation of the board mounting process, we pick up each process and explain it.
KAKEN TECH develops cleaning liquid for metal masks and flow pallets (carrier pallets), which are jigs and tools used in the board mounting process, and flux cleaning systems for printed circuit boards.Please consult us for any cleaning problems that occur in the PCB mounting process.
Mounting (component mounting) in the electronics industry refers to soldering electronic components such as semiconductor devices and IC chips to printed circuit boards, etc., and electrically connecting terminals and wiring to make them ready for operation. This page introduces typical mounting processes such as reflow and wave soldering process.
In the reflow process of electronics packaging, the most common method of supplying solder is to print solder paste using a metal mask. This section introduces the explanation of metal masks, the printing process, possible problems and cleaning.
In addition to what flux is, its role, composition, and types, we will also explain the problems caused by flux residue left after soldering and how to prevent them.
The green board-like objects found inside electronic devices and appliances around us are examples of printed circuit boards. Printed wiring boards and electronic circuit boards are collectively referred to as printed circuit boards, and this page will explain their types, structures, and manufacturing processes.
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