Flux cleaning

The Need for Flux Cleaning

Residual flux after soldering can affect the circuit’s performance.

With the recent increase in mounting density—including the use of small-size chips, narrow-pitch and fine-pitch mounting, as well as applications in the aerospace and automotive industries that demand high reliability—flux cleaning has become essential. Additionally, during post-process steps such as wire bonding, underfill insertion, moisture-proof coating, and potting resin application, residual flux can impair the adhesion of the applied materials, making flux cleaning necessary in these cases as well.

Furthermore, there is demand for flux cleaning to remove solder balls and to address contact issues with pin checkers during inspection processes.

Kaken Tech’s Flux Cleaning Systems (Comprehensive Cleaning Design for Liquid, Process and Equipment!)

In the field of flux cleaning for electronic circuit assembly, Kaken Tech was an early pioneer in establishing all three key pillars—“cleaning evaluation technology,” “cleaning agents,” and “cleaning equipment”—in-house, and has accumulated a wealth of experience in flux cleaning. Regarding the shift to lead-free and halogen-free solder, we were also quick to anticipate the increased difficulty of flux cleaning; the products we developed in advance have already proven themselves in the market and are well-received.

Furthermore, in response to the recently increasing demand for VOC (volatile organic compound) reduction, we have undertaken proactive development and are expanding our lineup of low-VOC cleaning agents in the flux cleaning field.