SMT stencil / screen mask cleaning

Solder Paste and Adhesive Cleaning Agent: HA Series

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  SMT stencil cleaning agent HA Series
  Oil Drum Type

What Are SMT Stencils and Screen Masks?

　In the electronics industry, processes involving the application of paste materials via screen printing are common. Screen printing is a type of stencil printing in which holes are punched into the stencil itself, and ink paste or similar materials are forced through those holes onto the substrate.

　Many materials—including solder paste (which contains solder), thick-film pastes such as those containing silver or palladium, conductive adhesives, resist ink, and temporary bonding agents (red bond)—are printed using SMT stencils and screen masks (mesh plates).

　In the maintenance of these printing plates (SMT stencils, screen masks), cleaning the apertures is essential for maintaining printing accuracy and reducing printing defects.

For a detailed explanation of SMT stencils, please see here.

PCB Assembly Column Printing Process and Troubleshooting Using SMT Stencils In the wave soldering process of electronics assembly, the most commonly used method for supplying solder is printing solder paste using an SMT stencil. This article explains SMT stencils, the printing process, potential issues, and cleaning procedures.

Issues with SMT Stencil and Screen Mask Cleaning Agents

Diverse Types of Contaminants
The resin components contained in various pastes, adhesives, and bonding agents differ significantly. Furthermore, since they often contain thixotropic agents—which are insoluble in solvents—to adjust viscosity, it is necessary to formulate cleaning agents specifically tailored to each material.

High Standards for the Work Environment
While this is not limited to the electrical and electronics industries, companies today are highly conscious of work environment standards, and it is necessary to comply with various safety-related laws and regulations regarding toxicity, odor, flammability, and combustibility.
In particular, there is a growing demand to replace IPA (isopropyl alcohol)—which has been widely used in the industry—due to its classification under the Industrial Safety and Health Act, the Organic Solvent Work Regulations, and the Fire Service Act.

Cost
While alternative CFCs and fluorinated solvents offer advantages in terms of flash point, they are 3 to 10 times more expensive than standard solvents.

Ensuring Compatibility with Target Workpieces
Improving cleanability can compromise the durability of the materials used in the target workpieces. Many target workpieces are SMT stencils or mesh screens, and the materials used on them include adhesives, emulsions, protective tape, and surface water- and oil-repellent treatments. The challenge lies in minimizing the impact on these materials while enhancing cleanability.

For more information on why SMT stencils are cleaned, please see this page.

	Troubleshooting Guide How to Clean SMT Stencils The solder paste printing process is one of the most critical steps in the PCB assembly process, and the cleanliness of the SMT stencils used is key to improving process and product quality. This page examines the optimal method for cleaning SMT stencils based on test results using IPA, cleaning agents, and ultrasonic cleaners.
	PCB Assembly Column Printing Processes Using SMT Stencils and Troubleshooting In the wave soldering process of electronics assembly, the most commonly used method for supplying solder is printing solder paste using an SMT stencil. This article explains SMT stencils, the printing process, potential issues, and cleaning procedures.