SMT stencil cleaner, HA series

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Introduction

KAKEN TECH has been developing cleaning agents for the electrical and electronics industries for many years, and has recognized many solder pastes, thick film pastes and inks, and component fixing bonds (commonly known as red bonds).
As a specialized manufacturer of cleaning agents, we develop cleaning agents from a variety of perspectives, including the following;

  • ■R&D of cleaning agent for various pastes, adhesives and bonds,
  • ■R&D for products that do not fall under various laws and regulations or have low odor,
  • ■Cleaning agent design with consideration of component resistance

Use in combination with a cleaning device is effective for improving cleanability!

We verified the cleaning of SMT stencils used for printing solder paste; please take a look at the effects of wiping by hand with IPA, using a cleaning spray, and using an automatic machine.

Recently, electronic substrates and components are becoming more and more precision structured year by year. As a result, the apertures of screen stencil have become micron-sized, and manual cleaning often results in poor cleaning due to residues remaining on the SMT stencil. For this reason, many companies have proposed automatic cleaning machines using ultrasonic waves or showers. KAKEN TECH's cleaning agents are recommended for SAWA CLEAN, a SMT stencil cleaning system series manufactured by SAWA CORPORATION. SAWA CLEAN is a cleaning system that irradiates ultrasonic waves directly onto SMT stencils and screen masks to clean even the smallest residues, eliminating the problems caused by immersion ultrasonic waves and shower cleaning.

General characteristics ~DG type~

Product # Advantages
HA-3399U Low odor. For automatic cleaning (back wiping) of printing presses.
HA-3076U Fast drying and high cleaning performance. Suitable for manual cleaning.
HA-1040U Good dry and cleaning ability. High versatility and many adoption records.
HA-4900U Low odor. Good cleanability and less damage to masks.
HA-1245U Less damage to masks, good cleanability for both solder paste and thick film paste.
HA-4045U Low odor. Reduce evaporation loss and achieve low running cost.
Product # HA-3399U HA-3076U HA-1040U HA-4900U HA-1245U HA-4045U
Suita
bility		 Solder
paste		 ◎ ◎ ◎ ◎ ◎ ◎*1
Thick film
paste		 ○ ◎ ○ ○ ◎ ○
Parts fixing
adhesives		 ○ ○ ○ ○ ◎ ○*1
Drying Rapid ←―――――――――――――――――→ Slow
Flash point 27℃ 28℃ 29℃ 43℃ 47℃ -
UNRTDG Class3
No.1993		 Class3
No.1993		 Class3
No.1993		 Class3
No.1993		 Class3
No.1993		 Class8
No.3267
Cleaning method Manual
Machine		 Manual Manual
Machine		 Manual Manual
Machine		 Machine
Package 13kg/UN can 15kg/UN can 16kg/UN can 14kg/UN can 17kg/UN can 18kg/UN can

General characteristics ~Non DG type~

Product #Advantages
HA-1286U Low evaporation loss, good cleanability for
both solder paste and thick film paste.
HA-2789U Low VOC. Splendid cleaning property among non DG cleaner.
HA-1285U Good cleaning ability. Easy control of moisture content.
HA-4040U Low odor. Less evaporation loss and achieve low running cost.
HA-3233U Good cleaning ability of thick film pastes. Good drying ability.
HA-3396U For cleaning dispensing nozzles of chip fixing adhesives.
HA-3275U Good cleaning property of solder pastes. Slow in drying/
HA-986 Dissolve thick film pastes well though mild to emulsion.
Rinse with water if needed.*2
Product # HA-1286U HA-2789U HA-1285U HA-4040U HA-3233U HA-3396U HA-3275U HA-986U
Suita
bility		 Solder
paste		 ◎*2 ◎ ◎ ○*2 ○ ○ ○ △
Thick film
paste		 ◎*2 ◎ ○ ○ ◎ ○ ○ ○
Parts fixing
adhesives		 ◎ ○ ○ △ ◎ ○ △ △
Drying Rapid ←―――――――――――――――――→ Slow
Flash point 64℃ 96℃ - - - 96℃ - -
UNRTDG N/A N/A N/A N/A N/A N/A N/A N/A
Cleaning method Manual
Machine		 Machine Manual
Machine		 Manual
Machine		 Manual
Machine		 Machine Manual
Machine		 Manual
Machine
Package 16kg/UN can 12kg/UN can 17kg/UN can 17kg/UN can 18kg/UN can 17kg/UN can 17kg/UN can 17kg/UN can

*1：When using the SAWA Ecobrid SC-AH100-LV (made by SAWA CORPORATION).
*2： When rinsing with water, use pure water or ion exchange water.

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