SMT stencil cleaner, HA series

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Improve metal stencil printing quality with powerful cleaning performance and an environmentally conscious design.
HA Series

Powerfully removes solder paste residues from fine apertures as well as stubborn adhesives and inks. As an alternative to IPA, the HA Series supports both workplace health and safety and high-quality electronics assembly.

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Features Solutions Under-Stencil Wiping Cleaner Selector
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Product Features

01

Powerful Cleaning and Dissolving Performance for Various Pastes and Adhesives

The neutral formulation helps prevent damage to metal stencils while delivering excellent cleaning performance on various solder pastes, component-fixing adhesives, and silver pastes.

02

Not Subject to Japan’s Fire Service Act or Organic Solvent Regulations

The lineup includes non-hazardous and low-odor products that help improve the work environment and reduce the use of IPA (isopropyl alcohol).

03

Single-Solution, Water-Free Process with No Non-Volatile Components

Because the cleaners contain no surfactants or other non-volatile components, no rinsing step is required. They leave no impurities on the stencil after cleaning, help prevent stickiness, and improve printing quality.

Common challenges

Are You Experiencing Any of These Cleaning or Quality Problems in Metal Stencil Printing and Cleaning Processes?

  • Printing Defects Caused by Solder Paste Residues in Fine Apertures
    Clogging in apertures for QFPs and miniature chip components cannot be fully removed, causing critical assembly defects such as bridging and incomplete printing in the next print cycle.
  • Strong Odor and Fire Risk Associated with IPA (Isopropyl Alcohol)
    The characteristic odor generated by evaporation during manual wiping fills the work area and degrades the working environment. Its low flash point also creates an ongoing concern about fires caused by static electricity or other ignition sources.
  • Changeover Delays Caused by Hardened Component-Fixing Adhesives and Inks
    Red adhesive and marking ink that have cured over time cannot be fully removed with conventional cleaners, requiring repeated wiping and significantly extending line changeover time.
  • Reduced Solder Paste Release Caused by Sticky Cleaner Residues
    When cleaners containing additives such as surfactants are used, non-volatile components may remain on stencil surfaces and in apertures, actually reducing solder paste transfer and release performance.

NEW! Under-Stencil Wipe Cleaner “Urabukin-chan”

No flash point, low cost, and not subject to regulations such as Japan’s Fire Service Act. Discover the features of “Urabukin-chan,” a safe, high-performance, water-based under-stencil wipe cleaner adopted by major printer manufacturers.

Recommended by Printer Manufacturers
Urabukin-chan is highly regarded for its safety, usability, and quality in electronics assembly environments and has been officially adopted as a recommended under-stencil wipe cleaner by printer manufacturers including FUJI Corporation and Yamaha Motor Co., Ltd.

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Find the Recommended Metal Stencil Cleaner

Select the options that most closely match your intended conditions, then click “Select.” The recommended product numbers and properties will be displayed.

Cleaning Target

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If none of the options apply, please contact us using thecontact format the bottom of this page.

View Comparison
　

Hazardous Material Type

High Cleaning Power + Fast Drying
HA-3090		 ✔ Suitable for removing silver paste, solder paste, and ink from metal and screen stencil apertures, as well as
　　a wide range of applications including degreasing.
✔ Fast drying and high dissolving power improve cleaning efficiency.
✔ Contains no non-volatile components, so no rinsing is required after cleaning.
Cleaning TargetFlash PointUN classificationCleaning MethodPackaging
Solder Paste
Thick-Film Paste		26℃Class 3/UN No. 1993Manual Wiping15 kg/can
No. 1 in Adoption Record!
HA-1040		 ✔ Widely adopted for removing solder paste and ink from metal and screen stencil apertures.
　　This cleaner removes these contaminants.
✔ Contains no non-volatile components, so no rinsing is required after cleaning.
✔ Contains no alkaline or acidic components, helping prevent damage to stencils.
Cleaning TargetFlash PointUN classificationCleaning MethodPackaging
Solder Paste29℃Class 3/UN No.1993Manual wiping/
Use in cleaning equipment		16 kg/can
Low Odor for Better Workability
HA-4900		 ✔ Removes resin contaminants such as solder paste and ink from metal and screen stencil apertures.
　　This cleaner removes resin-based contamination.
✔ Contains no specified malodorous substances, amines, or aldehydes and has no unpleasant odor.
✔ Contains no alkaline or acidic components, helping prevent damage to stencils.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Solder Paste43℃Class 3/UN No.1993Manual Wiping14 kg/can

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Non-Hazardous Type

A Popular Non-Hazardous Option!
HA-1285		 ✔ Removes solder paste and ink. Because it is not subject to Japan’s Fire Service Act,
　　there are no restrictions under that Act on storage quantity or storage location.
✔ Contains no non-volatile components, so no rinsing is required after cleaning.
✔ Contains no alkaline or acidic components, helping prevent damage to stencils.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Solder PasteNoneNot ApplicableManual wiping/
Use in cleaning equipment		17 kg/can
Very High Cleaning Performance and Low VOC
HA-2789		 ✔ Specially designed for the SAWA ECOBRID SC-AH100-LV.
✔ Reduces volatile organic compound (VOC) content by 66% compared with conventional solvent-based cleaners.
✔ Two phases with different properties, an oil phase and a water phase, make it easy to remove a wide range of contaminants.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Solder Paste
Thick-Film Paste		97℃Not ApplicableUse in cleaning equipment12 kg/can
Non-Hazardous, Low-Odor Type
HA-4040		 ✔ Removes resin contaminants such as solder paste and ink.
　　Contains no specified malodorous substances, amines, or aldehydes and has no unpleasant odor.
✔ Contains no non-volatile components, so no rinsing is required after cleaning.
✔ Contains no alkaline or acidic components, helping prevent damage to stencils.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Solder PasteNoneNot ApplicableManual wiping/
Use in cleaning equipment		17 kg/can

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Thick-Film Paste Cleaning

Hazardous Material Type

High Cleaning Power + Fast Drying
HA-3090		 ✔ Suitable for removing silver paste, solder paste, and ink from metal and screen stencil apertures, as well as
　　a wide range of applications including degreasing.
✔ Fast drying and high dissolving power improve cleaning efficiency.
✔ Contains no non-volatile components, so no rinsing is required after cleaning.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Thick-Film Paste
Solder Paste		26℃Class 3/UN No.1993Manual Wiping15 kg/can
Combines High Cleaning Power with Low Material Impact
HA-1245S		 ✔ Removes resin contaminants such as solder paste, thick-film paste, and ink from screen stencil apertures.
　　This cleaner removes resin-based contamination.
✔ Contains no non-volatile components, so no rinsing is required after cleaning.
✔ Contains no alkaline or acidic components, helping prevent damage to stencils.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Thick-Film Paste
Solder Paste
Component-Fixing Adhesive		47℃CClass 3/UN No.1993Manual wiping/
Use in cleaning equipment		17 kg/can

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Non-Hazardous Type

Very High Cleaning Performance and Low VOC
HA-2789		 ✔ Specially designed for the SAWA ECOBRID SC-AH100-LV.
✔ Reduces volatile organic compound (VOC) content by 66% compared with conventional solvent-based cleaners.
✔ Two phases with different properties, an oil phase and a water phase, make it easy to remove a wide range of contaminants.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Thick-Film Paste
Solder Paste		97℃Not ApplicableUse in cleaning equipment12 kg/can
Good Drying Performance for a Non-Hazardous Cleaner!
HA-3233		 ✔ Removes resin contaminants such as solder paste, thick-film paste, and ink from screen stencil apertures.
　　This cleaner removes resin-based contamination.
✔ Contains no non-volatile components, so no rinsing is required after cleaning.
✔ Contains no alkaline or acidic components, helping prevent damage to stencils.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Thick-Film PasteNoneNot ApplicableManual wiping/
Use in cleaning equipment		18 kg/can

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Component-Fixing Adhesive Cleaning

Cleaner Specifically for Red Adhesive
HA-3396		 ✔ Removes temporary-fixing adhesive and solder paste adhering to dispensing nozzles and metal or screen stencil apertures used in printing processes.
　　This cleaner removes temporary-fixing adhesive and solder paste.
✔ Has no unpleasant odor compared with conventional dispensing-nozzle cleaners.
✔ Contains no alkaline or acidic components, helping prevent damage to nozzles and stencils.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Component-Fixing Adhesive96℃Not ApplicableUse in cleaning equipmentSet of six 1 L bottles
4 L/can
17 kg/can
High Cleaning Power!
HA-1245S		 ✔ Removes resin contaminants such as solder paste, thick-film paste, and ink from screen stencil apertures and similar areas.
　　This cleaner removes resin-based contamination.
✔ Contains no non-volatile components, so no rinsing is required after cleaning.
✔ Contains no alkaline or acidic components, helping prevent damage to nozzles and stencils.
Cleaning TargetFlash PointUN ClassificationCleaning MethodPackaging
Thick-Film Paste
Solder Paste
Component-Fixing Adhesive		47℃Class 3/UN No.1993Manual wiping/
Use in cleaning equipment		17 kg/can

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Product Video: Combining with Cleaning Equipment Improves Cleaning Performance

We verified the cleaning of SMT stencils used for printing solder paste; please take a look at the effects of wiping by hand with IPA, using a cleaning spray, and using an automatic machine.

Recently, electronic substrates and components are becoming more and more precision structured year by year. As a result, the apertures of screen stencil have become micron-sized, and manual cleaning often results in poor cleaning due to residues remaining on the SMT stencil. For this reason, many companies have proposed automatic cleaning machines using ultrasonic waves or showers. KAKEN TECH's cleaning agents are recommended for SAWA CLEAN, a SMT stencil cleaning system series manufactured by SAWA CORPORATION. SAWA CLEAN is a cleaning system that irradiates ultrasonic waves directly onto SMT stencils and screen masks to clean even the smallest residues, eliminating the problems caused by immersion ultrasonic waves and shower cleaning.

Related products

Trouble solution
How to clean SMT stencils
The solder paste printing process is one of the most important processes in the PCB assembly process, and the cleanliness of the SMT stencil used is the key to improving the quality of the process and the product. On this page, we examine the optimal SMT stencil cleaning method based on the results of cleaning the SMT stencil with IPA, cleaning agents, and ultrasonic cleaners.
PCB Mounting Columns
Printing process and trouble with metal stencils
In the reflow process of electronics packaging, the most common method of supplying solder is to print solder paste using a SMT stencil. This div introduces the explanation of SMT stencils, the printing process, possible problems and cleaning.
Trouble solution
"Cleaning" in Electronics industory
Cleaning related to the mounting process is explained using the example of the double-sided mounting process, in which inserted components are mounted (flow process) after surface mounting (reflow process) .

Request a Preliminary Cleaning Test or Sample

Are you looking to eliminate the strong odor and fire risk associated with manual IPA wiping, completely prevent sticky or liquid residues on metal stencil surfaces by using a surfactant-free cleaner, or reduce initial and operating costs with a safer cleaner that does not require explosion-proof equipment?
We can conduct cleaning tests using the solder pastes currently used at your facility, including lead-free and halogen-free types, as well as component-fixing adhesives, and can provide evaluation samples suited to your cleaning method. Please contact us to discuss your application.

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