Introduction
HA-4900U is a hydrocarbon-based cleaner. Significantly lower odors than conventional detergents!
Advantages of HA-4900U
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Low odor
HA-4900U is consisted without 22 substances causing offensive odors and amine, aldehyde, etc., and has no unpleasant odors compared with conventional cleaner. |
High cleaning property
Specially formulated cleaner HA-4900U will strongly remove solder paste from stencils after printing. |
Easy to use
Since HA-4900U is free from nonvolatile ingredients, rinsing after cleaning is not necessary, and it can be easily wiped off with a waste cloth. |
Less damage to stencils / masks
HA-4900U is consisted of neutral components and does not damage the metal surface. |
Low toxicity
HA-4900U does not contain halogen-based solvents (chlorine, bromine, or fluorine-based) or highly toxic ingredients (toluene, xylene, IPA, etc.). |
General characteristics
| Main component |
Hydrocarbon-based |
| Specific gravity |
0.8 |
| Boiling point |
150℃ or more |
| Flash point |
43℃ |
| UN Class |
3 |
| UN No |
1993 |
| Packing Group |
Ⅲ |
| Packaging |
14kg/UN can |
Related articles and products
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Products information
- Metal / screen mask cleaner, HA series
- Can be used by hand or fed into cleaning equipment! A wide range of products are prepared for different types of pastes and adhesives!
It is also a great alternative to IPA.
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Products information
- [Long seller] Stencil cleaner, HA-1040U
- The high dissolving power of the cleaning agent cleans even the smallest openings.
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Trouble solution
- How to clean SMT stencils
- The solder paste printing process is one of the most important processes in the PCB assembly process, and the cleanliness of the SMT stencil used is the key to improving the quality of the process and the product. On this page, we examine the optimal SMT stencil cleaning method based on the results of cleaning the SMT stencil with IPA, cleaning agents, and ultrasonic cleaners.
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PCB Mounting Columns
- Printing process and trouble with metal stencils
- In the reflow process of electronics packaging, the most common method of supplying solder is to print solder paste using a metal mask. This section introduces the explanation of metal masks, the printing process, possible problems and cleaning.
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Trouble solution
- "Cleaning" in Electronics industory
- Cleaning related to the mounting process is explained using the example of the double-sided mounting process, in which inserted components are mounted (flow process) after surface mounting (reflow process) .
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