Introduction
HA-1040U is versatile type and frequently used in various customers.
Advantages of HA-1040U
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High cleaning property against solder pastes and inks.
HA-1040 is a cleaner mainly made of glycols and alcohols, and has been used as a cleaner for solder pastes and inks and for degreasing precise parts in Japan and overseas. |
User-friendly cleaner
HA-1040U has a higher flash point than widely used IPA and is easier to use because of its higher cleaning property. |
No need to control chemical balance
HA-1040U does not contain surfactants or water, there's no need for chemical balance control!
In addition, the rinsing process after cleaning is not necessary. |
Environmentally-friendly
It does not contain substances or chlorine-based solvents that may deplete the ozone layer. Of course, CFC-free and ethane-free! |
General characteristics
Main component |
Glycol-based |
Specific gravity |
0.92 |
Boiling point |
120℃ |
Flash point |
29℃ |
UN Class |
3 |
UN No |
1993 |
Packing Group |
III |
Packaging |
16kg/UN can |
Related articles and products
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Products information
- Metal / screen mask cleaner, HA series
- Can be used by hand or fed into cleaning equipment! A wide range of products are prepared for different types of pastes and adhesives!
It is also a great alternative to IPA.
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Products information
- [LOW odor!]Stencil cleaner, HA-4900U
- Low-odor type. It has almost no odor while maintaining its cleaning power, thus contributing to the improvement of the work environment.
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PCB Mounting Columns
- Printing process and trouble with metal stencils
- In the reflow process of electronics packaging, the most common method of supplying solder is to print solder paste using a metal mask. This section introduces the explanation of metal masks, the printing process, possible problems and cleaning.
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Trouble solution
- "Cleaning" in Electronics industory
- Cleaning related to the mounting process is explained using the example of the double-sided mounting process, in which inserted components are mounted (flow process) after surface mounting (reflow process) .
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