[Long seller] Stencil cleaner, HA-1040U

High cleaning property against solder pastes and inks.
HA-1040 is a cleaner mainly made of glycols and alcohols, and has been used as a cleaner for solder pastes and inks and for degreasing precise parts in Japan and overseas.

User-friendly cleaner
HA-1040U has a higher flash point than widely used IPA and is easier to use because of its higher cleaning property.

No need to control chemical balance
HA-1040U does not contain surfactants or water, there's no need for chemical balance control!
In addition, the rinsing process after cleaning is not necessary.

Environmentally-friendly
It does not contain substances or chlorine-based solvents that may deplete the ozone layer. Of course, CFC-free and ethane-free!

Metal / screen mask cleaner, HA series

Can be used by hand or fed into cleaning equipment! A wide range of products are prepared for different types of pastes and adhesives! It is also a great alternative to IPA.

[LOW odor!]Stencil cleaner, HA-4900U

Low-odor type. It has almost no odor while maintaining its cleaning power, thus contributing to the improvement of the work environment.

How to clean SMT stencils

The solder paste printing process is one of the most important processes in the PCB assembly process, and the cleanliness of the SMT stencil used is the key to improving the quality of the process and the product. On this page, we examine the optimal SMT stencil cleaning method based on the results of cleaning the SMT stencil with IPA, cleaning agents, and ultrasonic cleaners.

Printing process and trouble with metal stencils

In the reflow process of electronics packaging, the most common method of supplying solder is to print solder paste using a metal mask. This section introduces the explanation of metal masks, the printing process, possible problems and cleaning.

"Cleaning" in Electronics industory

Cleaning related to the mounting process is explained using the example of the double-sided mounting process, in which inserted components are mounted (flow process) after surface mounting (reflow process) .