KAKEN TECH has been developing cleaning agents for the electrical and electronics industries for many years, and has recognized many solder pastes, thick film pastes and inks, and component fixing bonds (commonly known as red bonds).
As a specialized manufacturer of cleaning agents, we develop cleaning agents from a variety of perspectives, including the following;
■R&D of cleaning agent for various pastes, adhesives and bonds,
■R&D for products that do not fall under various laws and regulations or have low odor,
■Cleaning agent design with consideration of component resistance
Use in combination with a cleaning device is effective for improving cleanability!
We verified the cleaning of SMT stencils used for printing solder paste; please take a look at the effects of wiping by hand with IPA, using a cleaning spray, and using an automatic machine.
Recently, electronic substrates and components are becoming more and more precision structured year by year. As a result, the apertures of screen stencil have become micron-sized, and manual cleaning often results in poor cleaning due to residues remaining on the SMT stencil. For this reason, many companies have proposed automatic cleaning machines using ultrasonic waves or showers. KAKEN TECH's cleaning agents are recommended for SAWA CLEAN, a SMT stencil cleaning system series manufactured by SAWA CORPORATION. SAWA CLEAN is a cleaning system that irradiates ultrasonic waves directly onto SMT stencils and screen masks to clean even the smallest residues, eliminating the problems caused by immersion ultrasonic waves and shower cleaning.
General characteristics ~DG type~
Product #
Advantages
HA-3399U
Low odor. For automatic cleaning (back wiping) of printing presses.
HA-3076U
Fast drying and high cleaning performance. Suitable for manual cleaning.
HA-1040U
Good dry and cleaning ability. High versatility and many adoption records.
HA-4900U
Low odor. Good cleanability and less damage to masks.
HA-1245U
Less damage to masks, good cleanability for both solder paste and thick film paste.
HA-4045U
Low odor. Reduce evaporation loss and achieve low running cost.
Product #
HA-3399U
HA-3076U
HA-1040U
HA-4900U
HA-1245U
HA-4045U
Suita bility
Solder paste
◎
◎
◎
◎
◎
◎*1
Thick film paste
○
◎
○
○
◎
○
Parts fixing adhesives
○
○
○
○
◎
○*1
Drying
Rapid ←―――――――――――――――――→ Slow
Flash point
27℃
28℃
29℃
43℃
47℃
-
UNRTDG
Class3 No.1993
Class3 No.1993
Class3 No.1993
Class3 No.1993
Class3 No.1993
Class8 No.3267
Cleaning method
Manual Machine
Manual
Manual Machine
Manual
Manual Machine
Machine
Package
13kg/UN can
15kg/UN can
16kg/UN can
14kg/UN can
17kg/UN can
18kg/UN can
General characteristics ~Non DG type~
Product #
Advantages
HA-1286U
Low evaporation loss, good cleanability for both solder paste and thick film paste.
HA-2789U
Low VOC. Splendid cleaning property among non DG cleaner.
HA-1285U
Good cleaning ability. Easy control of moisture content.
HA-4040U
Low odor. Less evaporation loss and achieve low running cost.
HA-3233U
Good cleaning ability of thick film pastes. Good drying ability.
HA-3396U
For cleaning dispensing nozzles of chip fixing adhesives.
HA-3275U
Good cleaning property of solder pastes. Slow in drying/
HA-986
Dissolve thick film pastes well though mild to emulsion. Rinse with water if needed.*2
Product #
HA-1286U
HA-2789U
HA-1285U
HA-4040U
HA-3233U
HA-3396U
HA-3275U
HA-986U
Suita bility
Solder paste
◎*2
◎
◎
○*2
○
○
○
△
Thick film paste
◎*2
◎
○
○
◎
○
○
○
Parts fixing adhesives
◎
○
○
△
◎
○
△
△
Drying
Rapid ←―――――――――――――――――→ Slow
Flash point
64℃
96℃
-
-
-
96℃
-
-
UNRTDG
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Cleaning method
Manual Machine
Machine
Manual Machine
Manual Machine
Manual Machine
Machine
Manual Machine
Manual Machine
Package
16kg/UN can
12kg/UN can
17kg/UN can
17kg/UN can
18kg/UN can
17kg/UN can
17kg/UN can
17kg/UN can
*1：When using the SAWA Ecobrid SC-AH100-LV (made by SAWA CORPORATION). *2：
When rinsing with water, use pure water or ion exchange water.
The solder paste printing process is one of the most important processes in the PCB assembly process, and the cleanliness of the SMT stencil used is the key to improving the quality of the process and the product. On this page, we examine the optimal SMT stencil cleaning method based on the results of cleaning the SMT stencil with IPA, cleaning agents, and ultrasonic cleaners.
In the reflow process of electronics packaging, the most common method of supplying solder is to print solder paste using a SMT stencil. This section introduces the explanation of SMT stencils, the printing process, possible problems and cleaning.
Cleaning related to the mounting process is explained using the example of the double-sided mounting process, in which inserted components are mounted (flow process) after surface mounting (reflow process) .
Please be as specific as possible in your inquiry.
Depending on the contents of your inquiry, it may take some time for us to reply to you.
For SDS, please contact us from [Requests for SDS] in the upper right corner. ※Sales through the inquiry form are strictly prohibited.
KAKEN TECH, MICROCLEANER, MICROCLEAN&MARKLESS and MARKLESS are trademarks of KAKEN TECH CO., LTD. in PRC.
KAKEN TECH is a trademark of KAKEN TECH CO., LTD. in the U.S..
Inquiry form