High performance, low VOC cleaning agents MICROCLEAN ECO & MARKLESS® ECO

Nano-Engineered Cleaning for Ultra-Fine Gaps and Particles
Removes contaminants from 30 μm gaps with high-performance,
low-VOC cleaning chemistry.

Simultaneously ensures insulation reliability for high-density printed circuit boards and cutting-edge semiconductor packages while complying with increasingly stringent VOC regulations. Our proprietary cleaning agents, refined to the nanoscale, powerfully tackle lead-free flux residues lurking in ultra-narrow gaps of 30 μm or less.

Inquiries about Catalogs, SDS, and Cleaning Tests
Features
Case Studies
Mechanism
Cleaning Effect
Physical Properties
Cleaning Equipment
Related Articles

Product Features

01

Simultaneous removal of flux residue and microscopic solder balls through nano-penetration into ultra-narrow gaps

Thanks to its nano-scale penetration and diffusion capabilities, it instantly penetrates deep into ultra-narrow gaps (spaces beneath chips) of 30 μm or less in high-density mounting packages. It effectively removes flux residue and microscopic solder balls.

02

Low-VOC, non-hazardous formulation fully compliant with China’s GB standards

Thanks to a proprietary formulation designed to reduce volatile organic compounds (VOCs), this product is fully compliant with various international environmental regulations, including China’s increasingly stringent GB standards (GB38508-2020). Since it is classified as non-hazardous for international transport, it not only reduces management costs but also facilitates international shipping to overseas factories.

03

Protection of Circuit Dielectric Properties and Ensured Drying Performance Through a Surfactant-Free Formula

To ensure the reliability of advanced electronic circuits, which are becoming increasingly dense and high-speed, the cleaning agent contains absolutely no surfactants, completely eliminating the risk of reduced dielectric constant or insulation resistance. Furthermore, it possesses significantly superior volatility compared to water-rinse (quasi-water) systems, preventing the formation of watermarks (drying marks).

Common Challenges

Are you facing quality defects or challenges with overseas regulations during the assembly process for semiconductor packages or ultra-high-density circuit boards?

  • Flux residue in extremely narrow gaps (under the chip) of 30 μm or less
    As flip chips and fine SMD components become increasingly high-density, competitors’ cleaning agents cannot fully penetrate the narrow gaps under the chips, leaving behind stubborn flux residue that causes insulation failures
  • Circuit shorts and reduced first-pass yield due to residual micro-solder balls
    Due to insufficient flux removal capability, micro-solder balls (particles) in the 30–50 μm range adhere to and remain on the PCB surface, causing the most severe type of defect: shorts between patterns.
  • Limitations in complying with strict environmental regulations (such as GB standards) at Chinese factories and overseas production sites
    Due to the tightening of VOC (volatile organic compound) regulations at local factories in China, conventional cleaning chemicals are in violation of GB standards (such as GB38508-2020), and companies are struggling with the risk of having to replace them due to future regulatory tightening
  • Increased logistics procedures and management costs associated with the international transport (import/export) of non-hazardous materials
    When exporting cleaning agents to overseas locations, transportation arrangements become complicated because the items in question are designated as hazardous materials, and costs for maintaining a safe local supply chain and storage facilities are becoming a strain
  • Surfactant residues (water rinsing system) Causing Degradation of High-Frequency Circuit Characteristics
    Although water-rinsing systems have been implemented, trace amounts of surfactants or adsorbed components remaining on the substrate surface are altering circuit characteristics—such as dielectric constant and insulation resistance—which are essential for next-generation substrates

Nano-scale Microfabrication Technology

KAKEN TECH had already launched a low-VOC cleaning agent that separates into oil and water phases (two-phase separation) and can effectively remove flux residues.
However, anticipating increased demand for flux cleaning in narrower gaps as component density increases, we began developing a new cleaning agent. By refining the oil phase of our conventional low-VOC cleaning agent down to the nanoscale, we have developed a new cleaning agent capable of powerfully removing flux residues from even the narrowest gaps—a task that was previously difficult.

Conventional low-VOC cleaning agent
(two-phase separation)
MICROCLEAN ECO Series

Before and After Cleaning Comparison Using MICROCLEAN ECO & MARKLESS® ECO

■ Comparison of Flux Cleanability in Narrow Gaps

MICROCLEAN ECO Series
Semi-aqueous cleaning agent
Cleaning Conditions:
MICROCLEAN ECO Series at 50℃C / Spray × After 10 minutes of cleaning 		　　Cleaning Conditions:
　　Semi-aqueous cleaning agent at 60℃ / Spray × After 10 minutes of cleaning
Test piece: PKG component, gap 30 um

■Particle Removal Performance

Microscopic Solder Balls
Target particle size: 30–50 um
Cleaning conditions: MICROCLEAN ECO Series (50℃ / ultrasonic cleaning for 1 minute)
Foreign Matter Adhering During Process
Sebum and sebum particles
Alumina particles
Target particle size: Sebum and sebum fragments / average 30 um, alumina particles / approx. 2 um
Cleaning conditions: MICROCLEAN ECO Series (50℃ / ultrasonic × 1 minute)

General Properties

Product name Cleaning agent
MICROCLEAN ECO-8100		 Rinse agent
MARKLESS® ECO-R81
Specific Gravity 0.98 0.98
Viscosity
(mPa・s)		 4 3
Surface Tension
(mN/m)		 32 31
Boiling point 100℃ or higher
Flash Point None
ODP 0
UNRTDG UN Class : N/A
UN No. : N/A
China VOC Regulations
(GB38508-2020)		 Semi-aqueous cleaning agents
Technical
Datasheet
Catalogue
download

Cleaning Equipment

Product Information
Flux Cleaning Machine MICROCLEANER®
In recent years, as electronic devices have become smaller and component placement denser, electronic circuits and components are required to be of increasingly higher quality and reliability, leading to a growing demand for flux cleaning. The MICROCLEANER® is the definitive flux cleaning machine! It contributes to improving the quality of printed circuit boards and electronic components.

Related articles

Technial report
New Environmentally Friendly High Performance Flux Cleaner/Rinse liquid
Introducing MICROCLEAN ECO-8100, a newly developed low-VOC, non-hazardous, high-performance flux cleaner, and MARKLESS ECO-R81, as a rinse liquid!
Trouble solution
What is flux, the leading actor of soldering ?
In addition to what flux is, its role, composition, and types, we will also explain the problems caused by flux residue left after soldering and how to prevent them.
Trouble solution
Tips on flux cleaning
Flux cleaning is a process to remove flux residue that is generated at the same time as soldering when mounting electronic components. This page explains why flux is cleaned, what cleaning methods are available, and what is required for efficient cleaning.

Request a Preliminary Cleaning Test or Sample

Are you facing challenges in advanced electronics assembly processes, such as:
“Completely removing solder balls and flux residues from ultra-fine gaps smaller than 30 μm,” “Achieving compliance with China's GB standards while also eliminating hazardous material classification,” or “Protecting the dielectric properties of high-frequency circuits with a surfactant-free cleaning solution”?
We offer pre-cleaning evaluations using actual products, including flux and solder ball removal testing, tailored to your workpieces and high-density PCB design specifications. Evaluation samples are also available upon request. Please feel free to contact us for further information.

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KAKEN TECH, MICROCLEANER, MICROCLEAN&MARKLESS and MARKLESS are trademarks of KAKEN TECH CO., LTD. in PRC.
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