Flux cleaning is indispensable for ensuring the reliability of high-density mounting substrates. Amidst tightening regulations on chemical substances, such as the discontinuation of CFC substitutes in accordance with environmental regulations and VOC regulations under China's GB standard, KAKEN TECH® has developed the MICROCLEAN ECO & MARKLESS®ECO Series, a high-performance, low-VOC cleaning agent that combines further high-precision cleaning with environmental friendliness.
Nano-size miniaturization technology
KAKEN TECH had already launched a low-VOC cleaning agent that effectively cleans flux residues using a two-phase separation of the oil and water phases.
However, with the increase in mounting density, we anticipated an increase in the need for flux cleaning agents for narrower gaps, and began development of a new cleaning agent. By miniaturizing the oil phase of conventional low-VOC cleaning agents down to the nanosize, we have developed a new cleaning agent that is capable of removing flux residue even from narrower gaps, which has been difficult to achieve until now.
☝Excellent narrow-gap cleanability and particle removal
The new concept of the cleaning mechanism makes it possible to clean flux in narrow gaps. Furthermore, it has excellent removal of particles (fine foreign substances in the process) such as minute solder balls, sebum, and fine particles, which have been difficult to remove with conventional flux cleaning agents.
☝Environmentally friendly, low VOC, non-hazardous
Approximately 70% of its composition is water, which reduces emissions of VOCs (volatile organic compounds) due to the drying process and volatilization. Non-flammable and it does not fall under the United Nations Recommendations on the Transport of Dangerous Goods (UNRTDG), so it can be transported as a normal product during international transportation.
Comparison of flux cleanability in narrow gap
MICROCLEAN ECO Series
Semi-aqueous cleaning agents
Cleaning condition： MICROCLEAN ECO Series 50℃/Jet x 10min
Cleaning condition： Semi-aqueous cleaning agents 60℃/jet x 10min
Work pieces：PKG parts 30um gap
Particle removal property
【minute solder balls】
Target particle size：30~50um Cleaning condition：MICROCLEAN ECO series (50℃/jet x 1min)
In recent years, as electronic devices have become smaller and mounted more densely, electronic circuits and components have required increasingly higher quality and reliability, and the need for flux cleaning has increased. MICROCLEANER® is the definitive flux cleaner! It contributes to higher quality of printed circuit boards and electronic components.
In addition to what flux is, its role, composition, and types, we will also explain the problems caused by flux residue left after soldering and how to prevent them.
Flux cleaning is a process to remove flux residue that is generated at the same time as soldering when mounting electronic components. This page explains why flux is cleaned, what cleaning methods are available, and what is required for efficient cleaning.
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