We are developing uniquely shaped silver powder in the photos below, which is called TK silver powders and silver paste which utilizes them with our original technologies in the world.
The TK PASTE is a conductive adhesive with a variety of characteristics, taking advantage of the unique features of TK silver powder, such as "forming a conductive path with a small amount of silver," "having a light apparent specific gravity," "having a uniform particle size," and "sintering at low temperatures."
New Topics
CN-7122S, non DG and can be transported at room temp, has joined in TK PASTE series!
CN-7122S is a slow drying type of the conventional product [CN-7120].
The drying speed is slower, so work such as positioning after applying paste is more comfortable!
Non DG and Non frozen during delivery
It does not come under UN Dangerous goods and not need to keep frozen while delivery(CN-7122S has to be kept FROZEN after delivery.), transportation cost can be reduced!
Room temperature drying!
CN-7122S can be dried at room temperature without equipment such as a hardening furnace. Drying time is 2 hours at 25℃ and 20 minutes at 40℃.
Flexible!
As the coating film after drying is flexible, the paste does not crack and retains conductivity even when the coating film is bent.
Removable!
Removal of bonded samples is also possible by reheating after drying.
The paste comes in an aluminum tube!
it can be applied easily without getting your hands dirty.
TK PASTE Line-up
Catalogue download
General catalog of conductive adhesive TK PASTE. In addition to the features and merits of TK PASTE,
Low silver, low temperature curing type CR-2800/CR-5200,
Room temperature drying type CN-7120/CN-7122S, and
High reliability type CR-3520/CR-3990 are introduced.
TK PASTE CR-2800 is a paste with an amazingly low silver content, using acorn-shaped TK silver powder and containing only 50 wt% silver to achieve a specific resistance of 10-3Ω・cm. With a specific gravity of 2.1, it is twice as light as the conventional product (80wt% silver) and can reduce the cost of using silver paste by half.
☆Conforms to China's VOC regulations (GB33372-2020)☆
Usage
Binder
Specific resistivity
Thermal conductivity
VIscosity
Curing condition
Package
Storage
Earth Shield
Epoxy resin
6x10-3Ω・cm
-
30Pa・S
90℃x60min
10g Syringe
Frozen (Under -10℃)
Low temp. curing/Good specific resistivity, CR-5200
TK Paste CR-5200 is a low temperature, short time curing paste containing low silver, developed for assembly and mountingof weak heat resistant modules or components. It maintains stable characteristics with little resistance change even after temperature cycling and high temperature/high humidity tests.
☆Conforms to China's VOC regulations (GB33372-2020)☆
Usage
Binder
Specific resistivity
Thermal conductivity
VIscosity
Curing condition
Package
Storage
SMT assembly
Epoxy
3x10-4Ω・cm
-
20Pa・S
100℃x60min
10g Syringe
Frozen (under -10℃)
Room temp. drying, CN-7120/CN-7122S
TK PASTE CN-7120 is a one-component, room temperature drying paste that does not require heating for curing and is easy to work with.
Ideal for conductive bonding of heat-sensitive electronic components. Easy to handle as it comes in a tube.
NEW!!Slow drying type CN-7122S is also lined up! The slow drying speed improves the workability when positioning after applying paste.
Quick-drying, CN-7120
Usage
Binder
Specific resistivity
Thermal conductivity
VIscosity
Curing condition
Package
Storage
Earth Shield
Thermoplastics
5x10-4Ω・cm
-
27Pa・S
25℃x60min
15g Aluminum tube
Frozen (under -10℃)
Slow-drying, CN-7122S
Usage
Binder
Specific resistivity
Thermal conductivity
VIscosity
Curing condition
Package
Storage
Earth Shield
Thermoplastics
5x10-4Ω・cm
-
10Pa・S
40℃x60min
15g Aluminum tube
Frozen (under -10℃)
High heat and electric conductive, CR-3520
TK PASTE CR-3520 is a one-component heat-curing silver paste with high electrical conductivity and heat transfer properties.
It has excellent reliability such as constant temperature and humidity resistance and cold and heat cycle resistance, and is most suitable for lead-free measures for die bonding materials.
Usage
Binder
Specific resistivity
Thermal conductivity
VIscosity
Curing condition
Package
Storage
Die bonding
Epoxy
5x10-5Ω・cm
20W/m・K
20Pa・S
130℃x30min ＋ 180℃x60min
5g Syringe
Frozen (under -10℃)
Sintering, CM-4230
High conductivity and high heat transfer silver paste sintered at low temperature
"TK Paste CM-4230" is a lead-free, high heat-dissipation type die bonding paste.
It can be sintered without pressure under N2 atmosphere.
Sintering at 200°C in air is possible. Densification is also possible by applying pressure during heating!
Conductive adhesives have been attracting more and more attention in recent years. The article explains the mechanism of conductivity, types of conductive adhesives, differences from solder and other common adhesives, and why conductive adhesives are necessary.
Conductive adhesives have been attracting more and more attention in recent years. The article explains the mechanism of conductivity, types of conductive adhesives, differences from solder and other common adhesives, and why conductive adhesives are necessary.
KAKEN TECH's technology shines! Explanation of low silver and low specific gravity type conductive adhesives utilizing specially shaped silver powder. What is specially shaped silver powder? Why does it show conductivity even with low silver content? What are the advantages of low silver? and other questions are explained.
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