Our company has been producing various types of specially-shaped "TK silver powder," including the world's first developed thorny silver powder as shown in the picture, one after another with our unique and sophisticated technologies.

We are also developing "TK PASTE," conductive adhesive with many features, maximizing the advantages of TK silver powder such as;

- Forms a conductive path with a little amount of silver
- Low apparent specific gravity
- Uniform particle diameter
- Sinters at a low temperature


Low silver-contained paste, costs only 50% of the conventional

"TK PASTE CR-2800" is an incredible silver paste with only 50wt% of silver contained with thorny TK silver powder realizing the resistivity of 10-3Ω・cm.

It costs only a half of conventional silver paste (80wt% silver contained) because of the powder's shape and low specific gravity, 2.1, allowing a double amount of use in the same weight.


Normal Temp. Dryable! One-liquid Silver Paste
"TK-PASTE CN-7120", one-liquid silver paste, requires no heat when curing. It dries at a normal temperature to greatly improve workability.
It best performs to join heat-sensitive electronic components, creating an electrical path. Easy to handle in tube.


Highly conductive silver paste best suited for diebonding
"TK PASTE CR-3520" is a highly conductive, highly heat transmitting one-liquid heat curing silver paste.
It has strong credibility on constant temperature and humidity resistance and thermal cycle resistance. You can now go lead-free on diebonding materials.


Silver paste of high electrical and thermal conductivity, sinterable at a low temperature
"TK PASTE CM-3212" realized remarkably high electrical and thermal conductivity with the contained silver sintering at a low temperature of 250°C.
*Reference: Silver melts at 961°C.

TK silver powder

TK PASTE CN-7120 Package

TK silver powder sintered at a low temperature

Product Name CR-2800 CN-7120 CR-3520 CM-3212
Feature Low cost, low specific gravity Ag paste
One-liquid, low temperature heat curing

Heat unnecessary!
Easy handling, one-liquid, room temperature drying
Highly reliable Ag paste for die bonding
One-liquid, heat curing
Micro-sized, low temperature sinterable Ag paste
One-liquid, low temperature sintering
Use Earth, shield Earth, shield Die bonding Die bonding
Resin Epoxy resin Thermoplastic resin Epoxy resin
Resistivity 6×10-3Ω・cm 5×10-4Ω・cm 4×10-5Ω・cm 5×10-6Ω・cm
Thermal Conductivity 20W/m・K 80W/m・K
Curing Condition 90°C*60 min. 25°C*60 min. 130°C*30 min.

180°C*60 min.
60°C*60 min.

250°C*60 min.
Package 200g (150cc) btl
10g (5cc) syringe
15g alminum tube 10g (5cc) syringe
Storage Condition Frozen (below -10°C) Frozen (below -10°C) Frozen (below -10°C) Frozen (below -10°C)

※Content in this page provides representative examples and is subject to change without prior notice.

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