2017-10-11 00:00:00 +0900

Come visit 47th INTERNEPCON JAPAN!!

Date: 17 Jan-19 Jan, 2017 (10AM-6PM, -5PM on 19 Jan)
Place: Tokyo Big Sight
Booth: E2-40, East 1 Hall

KAKEN TECH offers the greatest packaging solutions for any issues related to cleaning, removing and adhesion.

ODOR IS NO LONGER the issue with our newly developed;

- stencil cleaning chemicals

- reflow oven cleaning chemicals

- dispenser nozzle cleaning chemicals, and

- solder pallet cleaning chemicals.

We have wide selections of low odor cleaning chemicals available for variety of use for packaging line.

Stencil cleaning chemicals also come in spray bottle.

Talk to us and upgrade your work environment!


Come see our deflux system, the top share in the industry, with real machine demonstration at the booth.
New line of TK-PASTE, the high-profile silver contained conductive adhesives, will be introduced as well.

We look forward to your visit.
If you are interested, please contact us from the contact form.
Invitations will be sent from mid-Nov and onward.

2017-08-08 00:00:00 +0900

Dear Valued Customer,

     We would like to inform you that we will have a summer holiday
from Friday the 11th to Wednesday the 16th of August 2017.

     Any inquiries or e-mails received on our website during the above period
will be attended on or after the 17th of August.

     We apologize for any inconveniences it may cause and
thank you for your understanding.



2017-05-09 00:00:00 +0900

KAKEN TECH will participate in JISSO PROTEC 2017.


Date: 7-9 Jun, 2017 (10AM-5PM)

Place: Tokyo Big Sight

Booth: 4B-24, East 4 Hall


KAKEN TECH offers total cleaning solutions for electronic packaging line.


This year, we introduce our newly-invented cleaning chemicals

to drastically improve your working environment, widely

applicable to solder pallet, stencil, oven parts or even reflow

oven itself.


Demo tools for deflux and stencil cleaning systems to be

demonstrated as usual.

Please feel free to come visit our booth and enjoy the amazing

cleaning experience.


We also have TK-PASTE series, high-profile silver-contained

conductive adhesives as next-generation bonding material.

Our lineup includes one that cures at a low temperature

(100C*30min.) as an alternative to solder, and the other with

low-resistivity despite of 50wt% of silver contained that

endures high heat in reflow oven.


***We are now sending invitation letters***

If you would like one, please make a request from our



JPCA Show website

2013-04-08 00:00:00 +0900

English version is updated.

2013-03-05 00:00:00 +0900

English version is underway. Thank you for your patience.


▲ To the top of this page