|Our company has been producing various types of specially-shaped "TK silver powder," including the world's first developed thorny silver powder as shown in the picture, one after another with our unique and sophisticated technologies.
We are also developing "TK PASTE," conductive adhesive with many features, maximizing the advantages of TK silver powder such as;
- Forms a conductive path with a little amount of silver
- Low apparent specific gravity
- Uniform particle diameter
- Sinters at a low temperature
CR-2800Low silver-contained paste, costs only 50% of the conventional
"TK PASTE CR-2800" is an incredible silver paste with only 50wt% of silver contained with thorny TK silver powder realizing the resistivity of 10-3Ω・cm.
It costs only a half of conventional silver paste (80wt% silver contained) because of the powder's shape and low specific gravity, 2.1, allowing a double amount of use in the same weight.
CM-3212Silver paste of high electrical and thermal conductivity, sinterable at a low temperature
"TK PASTE CM-3212" realized remarkably high electrical and thermal conductivity with the contained silver sintering at a low temperature of 250°C.
*Reference: Silver melts at 961°C.
CR-3520Highly conductive silver paste best suited for diebonding
"TK PASTE CR-3520" is a highly conductive, highly heat transmitting one-liquid heat curing silver paste.
It has strong credibility on constant temperature and humidity resistance and thermal cycle resistance. You can now go lead-free on diebonding materials.
CN-3160LNo heat necessary! One-liquid, room temperature dryable silver paste
"TK PASTE CN-3160L" does not require heat when curing. It is a one-liquid paste that dries at a room temperature, improving your operating efficiency.
It is perfect for conductive joining of non-heat resistant materials such as PP and PET.
Offered in a tube, easy to handle.
TK silver powder
TK silver powder sintered at a low temperature
TK PASTE CN-3160L Package
|Feature||Low cost, low specific gravity Ag paste
One-liquid, low temperature heat curing
|Micro-sized, low temperature sinterable Ag paste
One-liquid, low temperature sintering
|Highly reliable Ag paste for die bonding
One-liquid, heat curing
Easy handling, one-liquid, room temperature drying
|Use||Earth, shield||Die bonding||Die bonding||Earth, shield|
|Resin||Epoxy resin||ー||Epoxy resin||Thermoplastic resin|
|Curing Condition||90°C*60 min.||60°C*60 min.
or 60°C*2 min.
* Dry to touch
|Package||200g (150cc) btl
10g (5cc) syringe
|ー||10g (5cc) syringe||15g alminum tube|
|Storage Condition||Frozen (below -10°C)||Frozen (below -10°C)||Frozen (below -10°C)||Chilled (below 10°C)|
※Content in this page provides representative examples and is subject to change without prior notice.